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Place of Origin: | P.R. China |
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Brand Name: | FOTMA |
Certification: | ISO9001:2008 |
Model Number: | Cu/MoCu/Cu |
Minimum Order Quantity: | 1 pcs |
Price: | Negotiable |
Packaging Details: | Paper cartons or plywood boxes |
Delivery Time: | 20-25 days after deposit |
Payment Terms: | T/T, L/C, Western Union, PayPal |
Supply Ability: | 10000pcs/month |
High Light: | Cu CPC Heat Sink,MoCu Heat Sink,Electronic Packaging Heat Sink |
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Cu/MoCu/Cu (CPC) Heat Sink
Heat Sink Description:
Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper clad layers.The ratio of the thickness in Cu:Mo-Cu:Cu can be varied. It has higher thermal conductivity than that of W(Mo)-Cu, Cu/Mo/Cu and is cheaper, so comparable speaking, it has higher price-quality ratio.
Heat Sink Product Properties:
Grade | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
CPC141 | 9.5 | 7.3 | 280(XY)/170(Z) |
Heat Sink Application:
Cu/MoCu/Cu(CPC) can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.
If you have interest about other composition of CPC like CPC232, CPC111, CPC300 and other contents, you can contact us free.